The Route to 66

The MicroAce 66 dicing saw is the latest machine from the Loadpoint stable. The 66 is the result of years of development, building on the hugely successful platform of the MicroAce series 3. The team at Loadpoint have retained all the best characteristics of the existing range, particularly the legendary reliability and ease of use.

The range of materials, applications and markets catered to by the 66 is extensive. The early successes have predominantly been in cutting PZT for sonar and ultrasonic applications, glass and quartz into the optical and photovoltaic Industries, as well as the traditional markets for silicon and micro electronic mechanical systems (MEMS).

The feedback from customers has been unanimous in that this is the best Loadpoint machine by far.

FEATURES INCLUDE:

• Quick set up, accurate alignment - Utilises state of the art pattern recognition software.
• Low cost production - Best cutting speed. Very reliable equipment, online diagnostics, UK based support.
• Low blade cost - No need to use conductive blades as the 66 has a unique blade height sensing system.
• Wafer reduction - The Microace 66 can easily reduce wafers using standard saw blades.
• Easy to use - The Nano Control system is the most intuitive system on the market.
• Peace of mind - The Microace 66 is designed and built in the UK, fully supported by the Loadpoint team.