|
ESI’s Semiconductor Products all hold market leading positions and have a strong IP position, with differentiated and protected technologies across a wide-range of core competencies. ESI enables the highest industry yields, providing the greatest economic benefit to its customers. ESI has applications across these segments: - Semiconductor Link Processing (#1 Market Position)
- Laser Trimming
- Vision
- Wafer Singulation (New Entrant, July 2008)
Our laser trimming products provide the industry with the most flexible laser processing solutions available. From thin-film-on-silicon, to hybrid trimming of components, ESI breaks performance barriers.
These systems precisely scribe, or adjust the parameters of, individual components by using a laser beam to remove exact amounts of material. The tools’ combination of parts handling, measurement sub-systems, and pattern recognition deliver higher yields and increased throughput – ultimately improving your bottom line.
Our superior laser trimming solutions are being employed by customers world-wide, including leading laser processing companies such as Applied Laser Technology, Inc. (ALT) |
Laser Trimm
