IMI’s thick-film photoresist and proprietary high aspect ratio plating technology makes tighter pitches, higher performance and smaller form factors possible, enabling our customers to remain on the outer envelope of advanced packaging and sensor design.
IMI’s fine pitch electroplated bumps and structures in Au, Au/Sn Alloy, Sn/Pb Alloy, In, Cu, Ni, & Ag in heights from 1 to 100 microns, with aspect ratios of better than 3:1 provide our customers with the process latitude that enables them to stay responsive to their program requirements while remaining ultra-competitive… even in low-volume or short-run programs.
An hour with IMI can advance your program by months…
