Flussmittel

Features:

  • VOC-Free
  • Halide/Halogen-Free
  • ORL0 Per IPC J-STD-004B
  • High SIR Performance
  • Compatible with all Leaded /Lead-Free Alloys
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Features: 
  • For use with Sn/Pb and Pb-Free alloys
  • Excellent Wetting
  • Wide Process Window
  • Used for Ball Attach

Features

  • Rosin Activated
  • Non-Corrosive Residues
  • Improved Soldering Performance
  • Residues Removable With a Saponifier
  • Can Be Foamed, Sprayed, Dipped or Brushed
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Features: 

  • Tin-Lead and Lead-Free Compatible
  • Dries Without Heat
  • Passes SIR in Raw State
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Features: 

  • Passes SIR in Raw State
  • Low-Residue
  • Extremely Safe for Rework
  • Halide-Free
  • Wide Process Window
  • Can Be Foamed, Sprayed, Misted, or Dipped
  • Excellent Wetting
  • Lead-Free Compatible
  • Available in Industry Standard Sizes
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Features: 

  • Halide/Halogen-Free
  • ROL0 Per IPC J-STD-004A/B
  • Low Post Process Residues
  • Fast Wetting with All Leaded and Lead-Free Alloys
  • IPC-A-610F Compliant
  • High SIR Performance
  • Broad Process Window
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NC263UR is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to promote enhanced wetting during the wave soldering process. NC263UR has a higher activity level and lower surface tension than other no-clean liquid fluxes. NC263UR performs well with bare copper, solder-coated, and organic coated PWBs, leaving

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